metal flap discs, also known as grinding, rotary friction element is working. Metal flap discs are used in the semiconductor industry super LSI wafer production concrete cutting discs of major process equipment. Typically cast iron or steel lapping plate using its life high quality disc, low thermal expansion coefficient. In the wafer processing process, particularly a fast grinding or polishing, and thermal deformation due to wear of the grinding disc, and the flatness of the wafer is difficult to ensure parallelism. Due to the small grinding disc wear high hardness, and the thermal expansion coefficient of silicon is basically the same and thus can speed grinding, polishing.
Especially in recent years the wafer size increases, the cutting wheels quality and efficiency of the silicon wafer grinding higher requirements. The use of silicon carbide ceramic grinding plate will make the quality and efficiency of silicon grinding has greatly improved. Meanwhile silicon carbide ceramic grinding disc can be used for grinding, polishing flat sheet or block other material objects. Fiber is the quality of basic MDF, hot mill processes throughout the production process is a very important process, and the key influence hot mill performance and potential to play again in the grinding, it can be said disc (grinding) is the most hot mill positive, the most active factor. Cut off wheels Grinding the direct separation of the fiber member, while the separation of the fiber itself also leads to wear and a great loss. Throughout the hot mill use cycle, the cost of replacing the grinding mill even more than the acquisition cost of the heat, and therefore understand the wear mechanism of grinding on the design, manufacture and correct selection of grinding is very important.