Thick diamond cutter processing methods are: mechanical grinding, polishing hot metal plate, ion beam, laser beam and plasma etching.

Diamond sintered body tool 2.3
The diamond thick film processing methods using a rolling average particle size of abrasive damage to the diamond grains of 32 ~ 37μm or directly obtained using Method HPHT diamond grains, grain powder piled on the WC-16wt% Co alloy, and then Ta foil to isolate polishing discs and sintered at 5.5GPa, 1500 ℃ for 60 minutes to prepare a diamond sintered body, the sintered body with the tools with high wear resistance.
2.4 monocrystalline diamond asphalt
Single-crystal diamond cutter diamond crystal is usually the head of fixed knife, knife head with a screw or plate fixed on the Tool Bar. Diamond knife fixing method in the head are: mechanical reinforcement method (pressing surface and the bottom surface of the polished diamond with the knife head is fixed to the pressing plate); powder metallurgy (diamond in the alloy powder by adding the pressure in the vacuum sintering, the diamond knife head is fixed); bonding and brazing (using an inorganic adhesive or other adhesive fixing diamond). Since the thermal expansion coefficient of diamond and matrix disparity, diamond easy to loose.
There are still some key issues need to be addressed, such as diamond thick film deposition processes high-speed large-area, controlling diamond film grain boundary density and defect density of the diamond industry, the low-temperature growth of diamond film, stainless steel cutting wheel diamond film and the substrate binding force and weak. Diamond Tool superior performance and broad development prospects attracted numerous experts to study abroad, and some have made a breakthrough, I believe that in the near future will be widely applied to the diamond cutter modern machining.