Between the diamond and having the general metal and alloys of high surface energy, resulting in a diamond can not be a general low melting point alloy infiltration, poor weldability. At present, by adding strong carbide forming elements or through the diamond surface treatment of metal and metal to enhance the diamond between the solderability of copper-silver alloy solder.

â‘  active brazing method
Generally with copper-silver alloy solder metal cutting disc containing Ti, without soldering flux in an inert gas or in vacuum. Commonly used solder composition Ag = 68.8wt%, Cu = 26.7wt%, Ti = 4.5wt%, is used for preparing an arc melting method and the powder metallurgy method. Ti as an active element in the welding process and generate C reflected TiC, improved wettability and adhesion strength of the diamond and the solder. The heating temperature is generally 850 ℃, incubated 10 minutes, slow cooling to reduce internal stress.
â‘¡ After the surface of the metallized pads
Metallized diamond surfaces by surface treatment technology of metal plating on the surface of the diamond, so that the surface having the properties of the metal or metalloid. Generally in the surface of the diamond plating Ti, Ti C reacts with TiC, TiC and Ag-Cu solder alloy has a good wettability and bonding strength. Titanium currently used methods are: the physical vacuum vapor deposition (PVD, including vacuum evaporation deposition, vacuum sputtering, vacuum ion plating), chemical vapor plating coverage and powder sintering. Single plated PVD reinforced concrete cutting discs method is low, diamond plating process temperatures below 500 ℃, the physical attachment between the coating and the diamond, no chemical metallurgy. Diamond CVD method Ti react with a strong metallurgical bond is formed, the reaction temperature is high, damage to the diamond.