Thick welded diamond cutting tool production process generally includes: preparation of large area diamond film; film cut diamond cutter shape stainless steel flap disc and size needed; welding and cutting tool diamond thick film substrate material; thick cutting edge diamond grinding and polishing cutting grinding discs. Preparation and cutting (1) diamond thick
Commonly used process for the preparation of diamond thick DC plasma jet CVD method. The diamond deposition to WC-Co alloy (mirror surface processing) on the substrate in the cooling process, the diamond film off automatically. This method of depositing speed (up to 930μm / h), relatively close bonding between the lattice, but the rough growth surface. Diamond films with high hardness, wear resistance, non-conductive determines its cutting method is laser cutting (cutting can be carried out in air, oxygen and argon environment). Not only metal flap disc can the use of laser cutting diamond thick cut to the desired shape and size, but also the angle of the tool can be cut out, with a narrow slit, the advantages of high efficiency.